Overview
Offerings
Requisites
Contacts
Chief Examiner(s)
Unit Coordinator(s)
Learning outcomes
Explain the principles, instrumentation, microfabrication process, packaging, assembly techniques and materials associated with micro-electro-mechanical systems (MEMS) and semiconductor-based devices.
Create simulation models for MEMS and semiconductor devices, packaging and assembly of integrated circuits.
Design microsystems emphasising the foundation structures for microsensors and actuators, diodes, transistors, CMOS integrated circuits and analyse their mechanical and electrical characteristics, reliability and stability under typical environmental conditions.
Propose research ideas to advance the areas of microsystem technologies.
Engage in teamwork to carry out microfabrication and characterisation while manufacturing microdevices.
Teaching approach
Assessment summary
Continuous assessment: 50%
Final assessment: 50%
This unit contains hurdle requirements that you must achieve to be able to pass the unit. You are required to achieve at least 45% in the total continuous assessment component and at least 45% in the final assessment component. The consequence of not achieving a hurdle requirement is a fail grade (NH) and a maximum mark of 45 for the unit.